14 Commits
Author SHA1 Message Date
hulk c7433a8df7 release(golden): 托底线整体替换为生产实装版原样复制(v26.1.0.3)并重编 B 槽固件
- 生产仓库(GitLab ceramixnano_eddy_cmake_vscode dev@151828f,已在机器上实装)原样复制 8 文件:Src/command.c、i2c.c、ldc1612.c、tmp112.c;Inc/command.h、i2c.h、ldc1612.h;CommunicationProtocol.md(copy 后 fc 逐字节核验一致)
- 保留 B 槽专属构建(LD 0x0800B000/0x4BF8、VTOR 0xB000、gap-fill 0xFF、BUILD_VARIANT=golden),仅 VERSION_PATCH 2→3 对齐生产
- 与 dev 线从此的功能差异属预期(勿"修复"):LDC1612 驱动电流 GEN(8)(生产 2026-03-23 调参,dev 线仍 GEN(18))、命令集 M1~M4+M999/M9999(无 M5/M6)、M4 无符号温度算法、旧 8 位寄存器地址 i2c 驱动(配套 tmp112/ldc1612 整组生效);IIC 新驱动留待后续 A 线版本
- 保底判定值 v26.1.0.2 → v26.1.0.3;两个版本号均永不再用于 OTA 升级包;dev 线后续 A 版本必须 > V1.0.3(当前 dev 同为 V1.0.3,正式发布前须升版)
- 重编译:text+data = 12,036B;向量表校验通过(复位向量 0x0800CC2C 落 B 槽)
- FACTORY 工厂镜像(BL EDDY V0.1.0 + B 满槽 + flag,A 擦除态)已打包:Build\golden\CeramixNano-EDDY_FACTORY_B-V1.0.3_2026-10-25.bin,12 项字节校验全过
2026-10-25 13:13:41 +08:00
hulk 722b02e755 docs: README 头部对齐双固件现状(golden V1.0.2 冻结 / dev V1.0.3,产物命名 CeramixNano-EDDY) 2026-10-24 23:58:22 +08:00
hulk 0022afb751 docs: 同步分支清理留档 2026-10-24 21:43:11 +08:00
hulk f556d1f590 docs: BL 改为专属并列分支 bootloader_CeramixNano_EDDY(LED=PB1,V0.1.0=4,040B) 2026-10-24 21:33:14 +08:00
hulk 8dcbfa9f99 build(golden): 出厂保底线定版——CeramixNano-EDDY 命名/板卡码 26/版本冻结 V1.0.2/variant=golden 2026-10-24 21:15:11 +08:00
hulk 4af24a4dfb build: golden 保底固件布局——LD ORIGIN 0x0800B000 (B 槽 19K-8B) + VECT_TAB_OFFSET 0xB000 2026-10-23 10:11:14 +08:00
hulk b6da450f8a build: 恢复正式发布布局 0x08002000/54K + VECT_TAB_OFFSET=0x2000
调试裸机布局(0x08000000/VTOR=0)仅限本地临时修改,不进仓库;
2026-10-02 23:21:47 +08:00
hulk de6afa1717 docs: AGENTS.md 记录 V1.0.2 发布 2026-10-02 23:09:37 +08:00
hulk 57963d179a build: 调试阶段 APP 临时链接 0x08000000(VECT_TAB_OFFSET=0,脱离 bootloader 直接运行)
正式发布仍用 V1.0.2 tag 处的 0x08002000/54K Bootloader 布局打包(见 Release V1.0.2)
2026-10-02 23:09:19 +08:00
hulk 8d5c33236d release:(1.0.2) 版本号提升至 V1.0.2 2026-10-02 23:07:59 +08:00
hulk a40c2ec793 build(vscode): 新增 DAPLink 专用烧录配置与任务
- openocd_daplink_gd32e23x.cfg:去掉 connect_assert_srst(该选项导致 DAPLink 下 Cortex-M23 识别失败)
2026-10-02 23:07:55 +08:00
hulk e81c902341 docs: 修正协议文档命令编号并补全 M4~M9999 帧格式说明;新增项目 AGENTS.md
- 温度上报命令由 M3 笔误更正为 M4,补充 M4 回复示例
2026-10-02 23:07:51 +08:00
hulk 07b631b254 feat(i2c): 导入模板 IIC 驱动改进(总线恢复重试/超时辅助函数/read_raw/scan AERR 处理) 2026-10-02 23:07:41 +08:00
hulk 89e7191cd5 build: 对齐模板工具链与 .vscode,APP 迁移 Bootloader 布局(0x08002000/54K)
工程编译与开发环境(参照 gd32e23x_template_cmake_vscode 模板)
- cmake/arm-none-eabi-gcc.cmake:硬编码工具链路径改为 GD32_GCC_BIN
  环境变量 / -DTOOLCHAIN_DIRECTORY 参数,与模板逐字一致
- .vscode:launch/tasks/settings/extensions 对齐模板,烧录与调试全部
  读取 GD32_GCC_BIN / GD32_OPENOCD_BIN / GD32_OPENOCD_SCRIPTS 环境变量;
  新增 J-Link 调试配置与 flash/reset/erase.jlink 脚本
- CMakeLists.txt:POST_BUILD 增加 Application/Application.hex 生成
  (J-Link 烧录脚本 loadfile 依赖)
- 验证:Debug / Release 编译通过(本机 ARM GCC 15.2.1)

Bootloader 布局适配(与旧版独立镜像不兼容,升级需整片烧录一次)
- LD/gd32e23x_flash.ld:FLASH ORIGIN=0x08002000, LENGTH=54K
- Src/system_gd32e23x.c:VECT_TAB_OFFSET=0x2000——Bootloader 不写
  VTOR,APP 必须自设向量表,否则中断落回 Bootloader 向量表
- 验证:.vectors 链接于 0x08002000,固件 12164B(54KB 上限 22%)

驱动修复
- Src/ldc1612.c:ldc1612_config_single_channel 各步骤 I2C 写入检查
  返回值,失败立即返回错误(原审查项 L3)

文档
- README:重写本地编译/烧录/调试说明,新增"固件布局与 Bootloader"章节
2026-09-26 18:41:29 +08:00
18 changed files with 658 additions and 310 deletions
+2
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@@ -0,0 +1,2 @@
erase
exit
+7 -25
View File
@@ -1,26 +1,8 @@
{
"recommendations": [
"ms-vscode.cmake-tools",
"ms-vscode.cpptools",
"ms-vscode.cpptools-extension-pack",
"ms-vscode.cpptools-themes",
"ms-vscode.vscode-embedded-tools",
"ms-vscode.hexeditor",
"ms-vscode.notepadplusplus-keybindings",
"twxs.cmake",
"xaver.clang-format",
"marus25.cortex-debug",
"cheshirekow.cmake-format",
"mcu-debug.debug-tracker-vscode",
"mcu-debug.memory-view",
"mcu-debug.peripheral-viewer",
"mcu-debug.rtos-views",
"trond-snekvik.gnu-mapfiles",
"zixuanwang.linkerscript",
"gurumukhi.selected-lines-count",
"gruntfuggly.todo-tree",
"vscode-icons-team.vscode-icons",
"jeff-hykin.better-cpp-syntax",
"dan-c-underwood.arm"
]
}
"recommendations": [
"marus25.cortex-debug",
"ms-vscode.cmake-tools",
"twxs.cmake",
"ms-vscode.cpptools"
]
}
+4
View File
@@ -0,0 +1,4 @@
loadfile Application.hex
r
go
exit
+32 -10
View File
@@ -9,20 +9,19 @@
"type": "cortex-debug",
"runToEntryPoint": "main",
"showDevDebugOutput": "none",
"gdbPath": "${workspaceFolder}/Toolchain/xpack-arm-none-eabi-gcc-11.3.1-1.1/bin/arm-none-eabi-gdb.exe",
"gdbPath": "${env:GD32_GCC_BIN}/arm-none-eabi-gdb.exe",
"servertype": "openocd",
"serverpath": "${workspaceFolder}/Toolchain/xpack-openocd-0.11.0-3/bin/openocd.exe",
"serverpath": "${env:GD32_OPENOCD_BIN}/openocd.exe",
"svdFile": "${workspaceFolder}/GD32E230.svd",
"liveWatch": {
"enabled": true,
"samplesPerSecond": 1
},
"configFiles": [
"${workspaceFolder}/Toolchain/xpack-openocd-0.11.0-3/scripts/target/openocd_gdlink_gd32e23x.cfg"
"${env:GD32_OPENOCD_SCRIPTS}/${config:gd32.openocd.targetConfig}"
],
"serverArgs": [
"-s", "${workspaceFolder}/Toolchain/xpack-openocd-0.11.0-3/scripts"
"-s", "${env:GD32_OPENOCD_SCRIPTS}"
],
"env": {
"OPENOCD_SCRIPTS": "${env:GD32_OPENOCD_SCRIPTS}"
},
"searchDir": [
"${workspaceFolder}"
],
@@ -30,7 +29,30 @@
"preRestartCommands": [
"load",
"continue"
],
]
},
{
"cwd": "${workspaceFolder}",
"executable": "${workspaceFolder}/Build/Debug/Application/Application.elf",
"name": "Debug with J-Link",
"request": "launch",
"type": "cortex-debug",
"runToEntryPoint": "main",
"showDevDebugOutput": "none",
"gdbPath": "${env:GD32_GCC_BIN}/arm-none-eabi-gdb.exe",
"servertype": "jlink",
"device": "${config:gd32.jlink.device}",
"interface": "${config:gd32.jlink.interface}",
"svdFile": "${workspaceFolder}/GD32E230.svd",
"liveWatch": {
"enabled": true,
"samplesPerSecond": 1
},
"preLaunchTask": "Build",
"preRestartCommands": [
"load",
"continue"
]
}
]
}
}
+23
View File
@@ -0,0 +1,23 @@
# DAPLink-friendly GD32E23x flash/debug config
# Difference vs target/openocd_gdlink_gd32e23x.cfg:
# - no connect_assert_srst (breaks target examination with the current DAPLink)
adapter driver cmsis-dap
transport select swd
source [find target/swj-dp.tcl]
source [find mem_helper.tcl]
set _CHIPNAME gd32e23x
swj_newdap $_CHIPNAME cpu -irlen 4 -ircapture 0x1 -irmask 0xf -expected-id 0x0BF11477
dap create $_CHIPNAME.dap -chain-position $_CHIPNAME.cpu
set _TARGETNAME $_CHIPNAME.cpu
target create $_TARGETNAME cortex_m -dap $_CHIPNAME.dap
$_TARGETNAME configure -work-area-phys 0x20000000 -work-area-size 0x1000 -work-area-backup 0
flash bank $_CHIPNAME.flash gd32e23x 0x08000000 0 0 0 $_TARGETNAME
adapter speed 1000
reset_config srst_only srst_nogate
cortex_m reset_config sysresetreq
+2
View File
@@ -0,0 +1,2 @@
r
exit
+11 -26
View File
@@ -1,30 +1,15 @@
{
"terminal.integrated.tabs.enabled": true,
"terminal.integrated.profiles.windows": {
"Git Bash": {
"path": "C:\\Program Files\\Git\\bin\\bash.exe",
"icon": "terminal-bash"
},
"Git-Bash": {
"path": "D:\\Git\\bin\\bash.exe",
"icon": "terminal-bash"
}
},
"terminal.integrated.defaultProfile.windows": "Git-Bash",
"clang-format.assumeFilename": ".clang-format",
"clang-format.executable": "clang-format",
"C_Cpp.default.configurationProvider": "ms-vscode.cmake-tools",
"cmake.configureOnOpen": true,
"cmake.buildDirectory": "${workspaceFolder}/Build",
"vcpkg.storageLocation": "C:\\Dev\\Tools\\vcpkg",
"cmake.useCMakePresets": "always",
"C_Cpp.default.configurationProvider": "ms-vscode.cmake-tools",
"cortex-debug.variableUseNaturalFormat": true,
"gd32.openocd.targetConfig": "target/openocd_gdlink_gd32e23x.cfg",
"gd32.openocd.massEraseCommand": "gd32e23x mass_erase 0",
"gd32.jlink.device": "GD32E230F8",
"gd32.jlink.interface": "SWD",
"gd32.jlink.speed": "4000",
"files.associations": {
"*.h": "c",
"*.c": "c",
"array": "c",
"string": "c",
"string_view": "c",
"ranges": "c",
"span": "c"
},
"cortex-debug.variableUseNaturalFormat": true,
}
"*.c": "c"
}
}
+221 -112
View File
@@ -1,116 +1,6 @@
{
"version": "2.0.0",
"tasks": [
{
"label": "Build and Flash",
"group": {
"kind": "build",
"isDefault": true
},
"dependsOn": [
"Build",
"Flash MCU"
],
"dependsOrder": "sequence",
"icon": {
"id": "insert",
"tooltip": "Build and Flash"
}
},
{
"label": "Flash MCU",
"type": "shell",
"command": "'${workspaceFolder}/Toolchain/xpack-openocd-0.11.0-3/bin/openocd.exe' -s '${workspaceFolder}' -f '${workspaceFolder}/Toolchain/xpack-openocd-0.11.0-3/scripts/target/openocd_gdlink_gd32e23x.cfg' -c 'init; reset halt; flash write_image erase ${command:cmake.launchTargetFilename}; reset; exit'",
"group": {
"kind": "build",
"isDefault": true
},
"problemMatcher": [],
"options": {
"cwd": "${command:cmake.buildDirectory}/Application",
"environment": {
"CLICOLOR_FORCE": "1",
"OPENOCD_SCRIPTS": ""
}
},
"presentation": {
"clear": true
},
"icon": {
"id": "gather",
"tooltip": "Flash MCU"
}
},
{
"label": "Reset MCU",
"type": "shell",
"command": "'${workspaceFolder}/Toolchain/xpack-openocd-0.11.0-3/bin/openocd.exe' -s '${workspaceFolder}' -f '${workspaceFolder}/Toolchain/xpack-openocd-0.11.0-3/scripts/target/openocd_gdlink_gd32e23x.cfg' -c 'init; reset; exit'",
"group": {
"kind": "build",
"isDefault": true
},
"problemMatcher": [],
"options": {
"cwd": "${command:cmake.buildDirectory}/Application",
"environment": {
"CLICOLOR_FORCE": "1",
"OPENOCD_SCRIPTS": ""
}
},
"presentation": {
"clear": true
},
"icon": {
"id": "discard",
"tooltip": "Reset MCU"
}
},
{
"label": "Mass Erase MCU",
"type": "shell",
"command": "'${workspaceFolder}/Toolchain/xpack-openocd-0.11.0-3/bin/openocd.exe' -s '${workspaceFolder}' -f '${workspaceFolder}/Toolchain/xpack-openocd-0.11.0-3/scripts/target/openocd_gdlink_gd32e23x.cfg' -c 'init; reset halt; gd32e23x mass_erase 0; exit'",
"group": {
"kind": "build",
"isDefault": true
},
"problemMatcher": [],
"options": {
"cwd": "${command:cmake.buildDirectory}/Application",
"environment": {
"CLICOLOR_FORCE": "1",
"OPENOCD_SCRIPTS": ""
}
},
"presentation": {
"clear": true
},
"icon": {
"id": "clear-all",
"tooltip": "Erase MCU"
}
},
{
"label": "OpenOCD Server",
"type": "shell",
"command": [
"'${workspaceFolder}/Toolchain/xpack-openocd-0.11.0-3/bin/openocd.exe' -s '${workspaceFolder}' -f '${workspaceFolder}/Toolchain/xpack-openocd-0.11.0-3/scripts/target/openocd_gdlink_gd32e23x.cfg'"
],
"group": {
"kind": "build",
"isDefault": true
},
"problemMatcher": [],
"options": {
"cwd": "${command:cmake.buildDirectory}/Application",
"environment": {
"CLICOLOR_FORCE": "1",
"OPENOCD_SCRIPTS": ""
}
},
"presentation": {
"clear": true
}
},
{
"label": "Build",
"type": "cmake",
@@ -130,7 +20,8 @@
],
"options": {
"environment": {
"CLICOLOR_FORCE": "1"
"CLICOLOR_FORCE": "1",
"OPENOCD_SCRIPTS": "${env:GD32_OPENOCD_SCRIPTS}"
}
},
"presentation": {
@@ -140,6 +31,224 @@
"id": "code",
"tooltip": "Build"
}
},
{
"label": "Build and Flash",
"dependsOn": [
"Build",
"Flash MCU"
],
"dependsOrder": "sequence",
"group": "build",
"icon": {
"id": "insert",
"tooltip": "Build and Flash"
}
},
{
"label": "Flash MCU",
"type": "process",
"command": "${env:GD32_OPENOCD_BIN}/openocd.exe",
"args": [
"-s", "${env:GD32_OPENOCD_SCRIPTS}",
"-f", "${env:GD32_OPENOCD_SCRIPTS}/${config:gd32.openocd.targetConfig}",
"-c", "init; reset halt; flash write_image erase ${command:cmake.launchTargetFilename}; reset; exit"
],
"group": "build",
"problemMatcher": [],
"options": {
"cwd": "${command:cmake.buildDirectory}/Application",
"environment": {
"OPENOCD_SCRIPTS": "${env:GD32_OPENOCD_SCRIPTS}"
}
},
"presentation": {
"clear": true
},
"icon": {
"id": "gather",
"tooltip": "Flash MCU"
}
},
{
"label": "Flash MCU (DAPLink)",
"type": "process",
"command": "${env:GD32_OPENOCD_BIN}/openocd.exe",
"args": [
"-s", "${env:GD32_OPENOCD_SCRIPTS}",
"-f", "${workspaceFolder}/.vscode/openocd_daplink_gd32e23x.cfg",
"-c", "program Application.elf verify reset exit"
],
"group": "build",
"problemMatcher": [],
"options": {
"cwd": "${command:cmake.buildDirectory}/Application",
"environment": {
"OPENOCD_SCRIPTS": "${env:GD32_OPENOCD_SCRIPTS}"
}
},
"presentation": {
"clear": true
},
"icon": {
"id": "zap",
"tooltip": "Flash MCU via DAPLink (no connect_assert_srst)"
}
},
{
"label": "Reset MCU",
"type": "process",
"command": "${env:GD32_OPENOCD_BIN}/openocd.exe",
"args": [
"-s", "${env:GD32_OPENOCD_SCRIPTS}",
"-f", "${env:GD32_OPENOCD_SCRIPTS}/${config:gd32.openocd.targetConfig}",
"-c", "init; reset; exit"
],
"group": "build",
"problemMatcher": [],
"options": {
"cwd": "${command:cmake.buildDirectory}/Application",
"environment": {
"OPENOCD_SCRIPTS": "${env:GD32_OPENOCD_SCRIPTS}"
}
},
"presentation": {
"clear": true
},
"icon": {
"id": "discard",
"tooltip": "Reset MCU"
}
},
{
"label": "Mass Erase MCU",
"type": "process",
"command": "${env:GD32_OPENOCD_BIN}/openocd.exe",
"args": [
"-s", "${env:GD32_OPENOCD_SCRIPTS}",
"-f", "${env:GD32_OPENOCD_SCRIPTS}/${config:gd32.openocd.targetConfig}",
"-c", "init; reset halt; ${config:gd32.openocd.massEraseCommand}; exit"
],
"group": "build",
"problemMatcher": [],
"options": {
"cwd": "${command:cmake.buildDirectory}/Application",
"environment": {
"OPENOCD_SCRIPTS": "${env:GD32_OPENOCD_SCRIPTS}"
}
},
"presentation": {
"clear": true
},
"icon": {
"id": "clear-all",
"tooltip": "Erase MCU"
}
},
{
"label": "OpenOCD Server",
"type": "process",
"command": "${env:GD32_OPENOCD_BIN}/openocd.exe",
"args": [
"-s", "${env:GD32_OPENOCD_SCRIPTS}",
"-f", "${env:GD32_OPENOCD_SCRIPTS}/${config:gd32.openocd.targetConfig}"
],
"group": "build",
"problemMatcher": [],
"options": {
"cwd": "${command:cmake.buildDirectory}/Application",
"environment": {
"OPENOCD_SCRIPTS": "${env:GD32_OPENOCD_SCRIPTS}"
}
},
"presentation": {
"clear": true
}
},
{
"label": "Build and Flash (Jlink)",
"dependsOn": [
"Build",
"Flash MCU (Jlink)"
],
"dependsOrder": "sequence",
"group": "build",
"icon": {
"id": "insert",
"tooltip": "Build and Flash (Jlink)"
}
},
{
"label": "Flash MCU (Jlink)",
"type": "process",
"command": "JLink.exe",
"args": [
"-device", "${config:gd32.jlink.device}",
"-if", "${config:gd32.jlink.interface}",
"-speed", "${config:gd32.jlink.speed}",
"-autoconnect", "1",
"-CommanderScript", "${workspaceFolder}/.vscode/flash.jlink"
],
"group": "build",
"problemMatcher": [],
"options": {
"cwd": "${command:cmake.buildDirectory}/Application"
},
"presentation": {
"clear": true
},
"icon": {
"id": "gather",
"tooltip": "Flash MCU (Jlink)"
}
},
{
"label": "Reset MCU (Jlink)",
"type": "process",
"command": "JLink.exe",
"args": [
"-device", "${config:gd32.jlink.device}",
"-if", "${config:gd32.jlink.interface}",
"-speed", "${config:gd32.jlink.speed}",
"-autoconnect", "1",
"-CommanderScript", "${workspaceFolder}/.vscode/reset.jlink"
],
"group": "build",
"problemMatcher": [],
"options": {
"cwd": "${workspaceFolder}"
},
"presentation": {
"clear": true
},
"icon": {
"id": "discard",
"tooltip": "Reset MCU (Jlink)"
}
},
{
"label": "Mass Erase MCU (Jlink)",
"type": "process",
"command": "JLink.exe",
"args": [
"-device", "${config:gd32.jlink.device}",
"-if", "${config:gd32.jlink.interface}",
"-speed", "${config:gd32.jlink.speed}",
"-autoconnect", "1",
"-CommanderScript", "${workspaceFolder}/.vscode/erase.jlink"
],
"group": "build",
"problemMatcher": [],
"options": {
"cwd": "${workspaceFolder}"
},
"presentation": {
"clear": true
},
"icon": {
"id": "clear-all",
"tooltip": "Erase MCU (Jlink)"
}
}
]
}
}
+157
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@@ -0,0 +1,157 @@
# AGENTS.md — CeramixNano EDDY(ldc1612_cmake_vscode)项目约定与进度
## 项目概述
CeramixNano EDDY 电涡流传感器单板固件(工程目录名沿用 ldc1612_cmake_vscode):
LDC1612(电涡流/电感数字转换器)+ TMP112(板载温度),RS485 串口命令协议
(`D5 03 LEN [cmd] CRC`,板卡类型 0x03),支持温度补偿与标定。
- 协议文档:`CommunicationProtocol.md`;寄存器速查:`LDC1612_REG_LIST.md`
- 命名/版本规则(2026-10-24 起):产物名 `CeramixNano-EDDY_*`,板卡码 **26**
(M999 应答 `v26.主.次.修订`,与 MB 的 25 同源规则);版本维护在
`cmake/project_config.cmake`(编译时生成 version.h,`Inc/version.h` 说法已过时)
## 工具链与构建
- 语言/环境:C99,GD32E23x 标准库(`SDK/`),MCU GD32E230F8(64K Flash/8K RAM)
- 编译器:xpack-arm-none-eabi-gcc 15.2.1(`GD32_GCC_BIN` 环境变量解析)
- 构建:CMake + Ninja,preset `Debug` / `Release`,输出 `Build/<preset>/Application/`
及 `Build/<preset>/CeramixNano-EDDY_<版本>_<variant>_<日期>.bin/.hex` 等
(variant:dev 线 `APP`,golden 线 `golden`)
- 烧录/调试(.vscode/tasks.json、launch.json):
- OpenOCD:`GD32_OPENOCD_BIN` 指向定制构建(含 gd32e23x flash 驱动,CMSIS-DAP 后端)
- `Flash MCU (DAPLink)` 任务 + `.vscode/openocd_daplink_gd32e23x.cfg`:
适配 DAPLink 探针(无 connect_assert_srst;该选项在此 DAPLink 上会导致
examination 失败,但 SRST 线是接通的,见下文排障)
- J-Link 任务需 SEGGER 探针 + PATH 中 JLink.exe(当前接的是 DAPLink,不适用)
- 调试器探针历史问题(2026-10-02 已解决):DAPLink 的 CMSIS-DAP v1 接口曾被 Zadig
装上 libwdi WinUSB 驱动(oem244.inf),导致 OpenOCD 枚举不到探针;删除该驱动包后
恢复 HID。若复发:管理员运行 `pnputil /delete-driver <oemNN.inf> /uninstall`。
- 串口验证:RS485 转 USB(FTDI,COM15),115200-8N1,**需同时置位 RTS+DTR**
(转换器方向控制),否则命令发不出去;DAPLink 虚拟串口为 COM8。
- 本地测试工具(git 不跟踪,在 `Toolchain/eddy_test/`):`eddy_cmd.py`(D5 帧命令行)、
`soc_ota.py`(PC 模拟 SOC 完整 OTA/Ymodem,支持 `--abort-after`/`--no-ca` 中止模式)、
`swd.py`(OpenOCD 封装:probe/image/boot/erasepage/read/dump)、`verify_pack.py`、
`verify_dump.py`(独立 CRC 复算与读回比对)。
## 硬件/板级约定(Inc/board_config.h)
- MCU:GD32E230(自动探测 Flash 容量,64KB → USART1 作 RS485)
- RS485:SP3487(无自动方向),USART1 PA2(TX)/PA3(RX),DE=PA1(USART 硬件 DE,AF1)
- I2C0:PF0(SDA)/PF1(SCL),硬件 IIC 100kHz(`SOFTWARE_IIC` 可切换软模拟,默认关闭)
- LED:PB1
- 传感器:LDC1612 @0x2B(40MHz 外部时钟),TMP112 @0x49(ADD0=GND)
- 调试宏(均默认关闭):DEBUG_VERBOSE / COM_DEBUG / LDC_DEBUG / EDDY_DRIVE_CURRENT_DETECTION
## 双固件布局(2026-10-24 移植完成,与 CeramixNano-MB 完全相同的 Flash 分配)
```
0x08000000 ┌─────────────────┐
│ Bootloader │ 8K 页 0~7 专属分支 bootloader_CeramixNano_EDDY(V0.1.0,4,040B)
0x08002000 ├─────────────────┤
│ FW_A 运行槽 │ 36K 页 8~43 OTA/Ymodem 接收区;锚点 A 记录@0x0800AFFC
0x0800B000 ├─────────────────┤
│ FW_B 出厂保底槽│ 19K 页 44~62 golden 线构建;B 记录@0x0800FBF8
0x0800FC00 ├─────────────────┤
│ 末页标志页 │ 1K 页 63 legacy 0xEEEE@0x0800FFFC
0x08010000 └─────────────────┘
```
- **BL = 并列板卡分支 `bootloader_CeramixNano_EDDY`**(BL 仓库,2026-10-24 自 MB 分支
创建;板卡宏 CERAMIXNANO_EDDY,**LED=PB1**,Ymodem 每成功烧录一包翻转一次,逻辑
同 MB 分支;版本独立编号 V0.1.0 = 4,040B,MD5 1dcc17bf…)。RS485 配置与 MB 逐宏
相同;**PA14 不被 BL 占用 ⇒ 升级会话期间 SWD 保持可用**(MB 分支 BL 的 LED=PA14
会占 SWCLK,勿混烧)。
- **A 线 = dev/main**:链接 0x08002000 / **LENGTH 36K**(LD 上限防溢出 B 槽),
VTOR 0x2000;版本从 V1.0.3 起(首个双固件 A 版本,码 26)。
- **B 线 = release/golden**:链接 0x0800B000 / LENGTH 0x4BF8(19K−8B,B 记录由打包
工具写入,链接区不含尾 8B——与 MB 的 .fw_tail 方案等价),VTOR 0xB000;
**版本冻结 V1.0.3 = 生产实装版原样复制(2026-10-25 起,见开发进度)**。保底判定值
= M999 返回 `v26.1.0.3` ⇔ 在跑 FW_B;`v26.1.0.2`(旧 golden)与 `v26.1.0.3` 均永不
再用于 OTA 升级包版本,dev 线后续 A 版本必须 > V1.0.3。此分支改动不得合回 dev/main。
- 打包:`hulk-mcu-firmware` skill / merge tool profile **`CeramixNano_EDDY_Dual_FW`**
(布局与 `CeramixNano_MB_Dual_FW` 逐字节相同),产出 `_UPDATE/_FULL/_FACTORY + MD5`。
- 升级链路:上位机(原 SOC 职责)—RS485—> BL(Ymodem);APP 用 `M9999` 软复位进
升级模式(SWRSTF=1 ⇒ BL 直留升级模式)。握手:BL 发 `ok` → `0x30` → BL `ok` →
`0x31` → 预擦 A+末页 → `'C'` 周期 → Ymodem(文件头 ACK 后 **ACK+'C' 连发**,
发送器须一次等齐)→ EOT → ACK×2 → 跳新固件。
- 完全体方案文档:`E:\Hulk-Coding\capsule_mb_camke_vscode\doc\双固件方案_完全体说明.md`。
## 开发进度
### 已完成
- LDC1612 驱动(初始化/单通道配置/原始值读取/状态检查)
- TMP112 驱动(初始化/温度读取/阈值/单次转换)
- RS485 命令体系:M1/M2(周期上报开关)、M3(涡流原始值)、M4(温度×10000)、
M5(温度补偿涡流值)、M6(标定数据:涡流+温度)、M999(版本)、M9999(复位)
- v1.0.1:涡流传感器温度标定方法与标定命令(M6)
- 2026-10-02:IIC 驱动改进导入(总线恢复重试/超时辅助/read_raw/scan AERR 处理);
硬件全命令实测通过;DAPLink 烧录问题解决;发布 V1.0.2(Gitea Release + tag)
- **2026-10-24:双固件(出厂救援)方案移植完成并全链路实测通过**(详见下节)
- BL 仓库新建并列板卡分支 `bootloader_CeramixNano_EDDY`(LED=PB1,V0.1.0 = 4,040B,
每收包翻转一次;此前短暂采用"复用 MB bin"方案,因 LED 引脚不同已废弃并重打包)
- dev:LD 54K→36K、命名 CeramixNano-EDDY、板卡码 26、V1.0.3;
golden:V1.0.2 冻结命名 + variant=golden
- 两线 CMake 补齐 `--gap-fill=0xFF` 与 `LD LINK_DEPENDS`
- fw_pack 新增 `CeramixNano_EDDY_Dual_FW` profile(55 项回归过,skill 缓存已同步)
- 产物(`Build/test/dualfw_2026-10-24/`):UPDATE(12 页,trailer 0x5C09000C)、
FULL(EDDY BL + A=V1.0.3/B=V1.0.2,19 项校验过)、FACTORY(12 项校验过)+ MD5 清单;
独立 python XMODEM 复算全部命中
- **硬件实测矩阵(SWD 探针 PC 采样 + 485 命令双重手段,全部 PASS;先用 MB bin 实测,
换 EDDY 专属 BL 后 FULL/FACTORY/OTA 全周期复测通过)**:
FACTORY→跳B(v26.1.0.2) / FULL→记录路径跳A(v26.1.0.3) / PC 模拟 SOC 完整 OTA
44s 成功+读回整片逐字节与包一致(B 区在真实 OTA 中毫发无损)/
擦锚点页→legacy 跳A / 锚点在位毁A体→CRC 拦截直落B(防降级)/
再毁B体→拒跳坏固件停留 BL(PC=0x080001B6) / OTA 第4包 CA 中止→落B /
非整页裸 bin 包→头部预检 CA×2 拒收→落B / M3/M4/M6 功能全通
- **2026-10-25:golden 托底线整体替换为生产实装版原样复制**(用户决策:生产版已在
机器上实装,托底必须与其同源,不做任何"顺手改进";IIC 新驱动等留给后续 A 线新版本):
- 来源:生产仓库(GitLab `ceramixnano_eddy_cmake_vscode`,dev@151828f,v26.1.0.3,
2026-03-23 已含驱动电流调参 GEN(18)→GEN(8));复制 8 文件(Src: command.c/i2c.c/
ldc1612.c/tmp112.c;Inc: command.h/i2c.h/ldc1612.h;CommunicationProtocol.md),
复制后 `fc /b` 逐字节核验一致
- golden 从此与 dev 线的功能差异(**属预期,勿"修复"**):LDC1612 驱动电流 **GEN(8)**
(dev 线仍为 GEN(18),后续 A 线新版本需评估回合生产调参);命令集 **M1~M4 +
M999/M9999(无 M5/M6)**;M4 温度为生产版无符号算法;i2c 为旧 8 位寄存器地址 API
驱动(与 tmp112.c/ldc1612.c 配套,整组生效)
- golden 保留项(B 槽专属构建):LD 0x0800B000/0x4BF8、VTOR 0xB000、gap-fill 0xFF、
BUILD_VARIANT=golden;仅 VERSION_PATCH 2→3 与生产对齐
- **保底判定值改为 `v26.1.0.3`**;注意 dev 线当前同为 V1.0.3(10-24 的 FULL 测试包
A=V1.0.3)——后续 A 线正式版本必须升到 V1.0.4 以上,否则 M999 无法区分保底
### 计划 / TODO
- dev → main 合并待发布节奏(V1.0.3 为首个双固件 A 版本,main 仍是 54K 单槽布局)
- M5 温度补偿系数目前为 0(TEMP_COMP_COEFF_*),待标定后填入实际温漂系数
- 上位机/SOC 侧需预存保底判定值 `v26.1.0.3`(跑 B ⇒ 升级未生效重推;2026-10-25 起判定值随生产版复制从 v26.1.0.2 改为 v26.1.0.3)
- (可选)模板侧 SEGGER RTT / CFG_ENABLE 宏体系同步
### 已删除的历史分支(2026-10-24 清理,均为开发过程产物)
- `dev_more_information`(远端):零独有提交,内容早已全部并入 main/dev。
- `dev_feature_iic_more_byte`(远端):仅 2 个 2025-08-25 的孤立实验提交,从未接入构建——
`75ea93c`(iic_new.c 975 行并行驱动实验,实际采用的是后来模板导入 i2c.c 的改进)、
`dbb6569`("dlpc3421 driver from kimi",DLPC3421 为 MB 光机芯片,与本板无关)。
如需找回:本地对象库在 gc 前仍可 `git show <hash>`。
### 教训(避免复发)
- **SWRSTF 残留**:M9999/调试器软复位置位的 SWRSTF **不随 NRST/SRST 清除**(仅 POR
或 RSTFC 清),此后任何复位 BL 都直进升级模式、不跳 APP——表现为"设备沉默,
M999 无响应,但 0x30 能回 ok"。排障/测试时须 SWD `mww 0x40021024 0x01000000`
清标志后再放跑(`swd.py boot` 已内置)。
- **(历史)误烧 MB 分支 BL 会让 SWD 在 0x30 后失联**:MB 分支 BL 的 LED=PA14
(SWCLK),0x30 应答后切输出 ⇒ SWD 死。**本板专用 `bootloader_CeramixNano_EDDY`
分支 LED=PB1,PA14 不占用,升级会话期间 SWD 全程可用**(2026-10-24 起所有镜像
均为 EDDY BL,此坑仅存档)。若真误烧:`M9999` 复位(有 APP 时)或用
connect_assert_srst 变体 cfg(`Toolchain/eddy_test/daplink_srst.cfg`)脉冲 SRST
复位恢复——SRST 线已验证接通,但该 DAPLink 下 examination 必失败属正常,
复位本身生效。
- **Ymodem 文件头 ACK 后是 ACK+'C' 连发**:发送器若分两次等会永远等不到第二个 'C'
(首次 OTA 调试即栽在此,BL 无超时会卡死;随后发 5×CA 可解)。
- OpenOCD `program`/`dump_image` 的文件路径必须转正斜杠,否则 Tcl 吃掉 `\l` `\t`。
- legacy 路径(锚点擦除态+flag 在)**没有 CRC 安全网**:实测毁 A 体后仍会跳进坏 A
导致 HardFault(xPSR=0x41000003)——这正是 v5 记录机制存在的意义,量产镜像必须
带锚点(FULL/OTA 正常路径均带)。
+5 -1
View File
@@ -62,6 +62,9 @@ target_link_options(${PROJECT_NAME} PRIVATE
-T${CMAKE_SOURCE_DIR}/LD/gd32e23x_flash.ld -Xlinker
-L${CMAKE_SOURCE_DIR}/LD
)
# LD 变更时触发重链接(改布局不重编也要重新生成 bin)
set_target_properties(${PROJECT_NAME} PROPERTIES LINK_DEPENDS
${CMAKE_SOURCE_DIR}/LD/gd32e23x_flash.ld)
# 生成 map 文件等
target_link_options(${PROJECT_NAME} PRIVATE
@@ -79,7 +82,8 @@ add_custom_command(TARGET ${PROJECT_NAME}
POST_BUILD
COMMAND echo -- Running Post Build Commands
COMMAND ${CMAKE_OBJCOPY} -O ihex $<TARGET_FILE:${PROJECT_NAME}> ${CMAKE_CURRENT_BINARY_DIR}/${OUTPUT_PREFIX}.hex
COMMAND ${CMAKE_OBJCOPY} -O binary $<TARGET_FILE:${PROJECT_NAME}> ${CMAKE_CURRENT_BINARY_DIR}/${OUTPUT_PREFIX}.bin
COMMAND ${CMAKE_OBJCOPY} -O ihex $<TARGET_FILE:${PROJECT_NAME}> $<TARGET_FILE_DIR:${PROJECT_NAME}>/Application.hex
COMMAND ${CMAKE_OBJCOPY} -O binary --gap-fill=0xFF $<TARGET_FILE:${PROJECT_NAME}> ${CMAKE_CURRENT_BINARY_DIR}/${OUTPUT_PREFIX}.bin
COMMAND ${CMAKE_SIZE} $<TARGET_FILE:${PROJECT_NAME}>
COMMAND ${CMAKE_OBJDUMP} -h -S $<TARGET_FILE:${PROJECT_NAME}> > ${CMAKE_CURRENT_BINARY_DIR}/${OUTPUT_PREFIX}.list
COMMAND ${CMAKE_SIZE} --format=berkeley $<TARGET_FILE:${PROJECT_NAME}> > ${CMAKE_CURRENT_BINARY_DIR}/${OUTPUT_PREFIX}.bsz
-4
View File
@@ -105,8 +105,4 @@ void eddy_current_report(void);
void temperature_raw_value_report(void);
void eddy_current_compensated_report(void);
void calibration_data_report(void);
#endif // COMMAND_H
+1 -1
View File
@@ -445,7 +445,7 @@
// 参数 idrive: 0-31之间的整数
#define LDC1612_DRIVE_CURRENT_GEN(idrive) ( (uint16_t)(idrive) << 11 )
#define LDC1612_DRIVE_CURRENT LDC1612_DRIVE_CURRENT_GEN(18) // 0x9000
#define LDC1612_DRIVE_CURRENT LDC1612_DRIVE_CURRENT_GEN(8) // 0x9000
/**************************IDs (Read Only 0x7E 0x7F)***********************************/
+3 -1
View File
@@ -10,9 +10,11 @@ _Min_Heap_Size = 0x200; /* required amount of heap */
_Min_Stack_Size = 0x400; /* required amount of stack */
/* Memories definition */
/* FW_B 保底槽布局:0x0800B000~0x0800FC00 共 19K,末 8B(0x0800FBF8 起)为 B 记录
* {magic16,pages16,crc16,2B 保留},由打包工具写入,链接区上限 = 槽 - 8B = 0x4BF8 */
MEMORY
{
FLASH (rx) : ORIGIN = 0x08000000, LENGTH = 32K
FLASH (rx) : ORIGIN = 0x0800B000, LENGTH = 0x4BF8
RAM (xrw) : ORIGIN = 0x20000000, LENGTH = 8K
}
+78 -18
View File
@@ -1,11 +1,36 @@
# GD32E23x 工程模板
# CeramixNano-EDDY(LDC1612)传感器固件
本仓库为兆易创新 GD32E23x 系列 MCU 的 CMake + VSCode 工程模板,适合嵌入式开发快速上手和团队协作。
本仓库基于 GD32E23x CMake + VSCode 工程模板(`gd32e23x_template_cmake_vscode`),包含 LDC1612 电感采样、TMP112 温度采集及补偿、RS485 命令处理。**版本按分支区分**:`release/golden` = 出厂保底线 **V1.0.3(冻结,生产实装版原样复制)**;`dev` = 双固件 A 线 **V1.0.3(开发中)**;`main` = 旧单槽布局线(LDC1612 旧名,V1.0.2)。固件采用双固件(出厂救援)布局:dev 线 APP 链接在 `0x08002000`(36KB A 槽 / 8KB RAM),golden 线链接 `0x0800B000`(B 槽),启动时自设向量表偏移;布局详情见下文「固件布局与 Bootloader」,开发进度见 `AGENTS.md`。
## 本地编译
需要 CMake 3.20 或更新版本、Ninja 和 ARM GCC。CMake、Ninja 应在 `PATH` 中;ARM GCC 通过 `GD32_GCC_BIN` 指定,也可在配置时传入 `-DTOOLCHAIN_DIRECTORY="D:/toolchain/arm-gcc/bin"`,该参数优先于环境变量。工具链路径支持包根目录或 `bin` 目录。
在工程根目录运行 PowerShell(工具链路径请替换为本机安装位置):
```powershell
$env:GD32_GCC_BIN = 'D:\toolchain\xpack-arm-none-eabi-gcc-15.2.1-1.1\bin'
cmake --preset Debug
cmake --build --preset Debug
cmake --preset Release
cmake --build --preset Release
```
输出位于 `Build/Debug` 或 `Build/Release`:`Application/Application.elf` 用于调试,`CeramixNano-EDDY_<版本>_<BUILD_VARIANT>_<日期>.bin` / `.hex` 为应用固件;`Application/Application.hex` 供 J-Link 烧录任务使用。应用固件不含 Bootloader:单独烧录需写到 `0x08002000`;整片烧录(Bootloader + APP + 标志页)用配套的固件合并工具(`gd32e230f8_firmware_merge_tool` 仓库)处理。详见[固件布局与 Bootloader](#固件布局与-bootloader)。
如果切换 ARM GCC 版本,请使用新的构建目录,或通过 CMake Tools 的 “Delete Cache and Reconfigure” 重新配置。需要独立验证目录时可运行:
```powershell
cmake --preset Debug -B Build/local-check/Debug
cmake --build Build/local-check/Debug
```
---
## 目录
- [本地编译](#本地编译)
- [固件布局与 Bootloader](#固件布局与-bootloader)
- [适用范围](#适用范围)
- [默认配置](#默认配置)
- [工具链准备](#工具链准备)
@@ -16,6 +41,30 @@
---
## 固件布局与 Bootloader(双固件,2026-10-24 起)
GD32E230F8(64KB Flash)采用与 CeramixNano-MB 相同的双固件(出厂救援)布局:
| 区域 | 地址范围 | 说明 |
|---|---|---|
| Bootloader | `0x08000000` - `0x08001FFF`(8KB,页 0~7) | **专属分支 `bootloader_CeramixNano_EDDY`**(V0.1.0,4,040B,LED=PB1,Ymodem 每烧录一包翻转一次;与 MB 分支并列、版本独立编号)——启动判定链 + RS485 Ymodem OTA;PA14 不占用,升级会话期间 SWD 可用 |
| FW_A 运行槽(本仓库 dev/main) | `0x08002000` - `0x0800AFFF`(36KB,页 8~43) | 唯一 OTA/Ymodem 接收区;链接 `ORIGIN=0x08002000, LENGTH=36K`(上限防溢出 B 槽);槽尾锚点 A 记录 @`0x0800AFFC` |
| FW_B 出厂保底槽(release/golden 分支) | `0x0800B000` - `0x0800FBFF`(19KB,页 44~62) | 出厂救援固件(版本冻结 V1.0.3,生产实装版原样复制),OTA 永不擦写;B 记录 @`0x0800FBF8` |
| 末页标志页 | `0x0800FC00` - `0x0800FFFF`(1KB,页 63) | legacy 标志 `0xEEEE` @`0x0800FFFC` |
启动判定:A 记录在位 ⇒ trailer 比对 + 固件体 CRC 复算 + 向量校验 ⇒ 跳 A(不过直落 B,防降级);锚点擦除态 ⇒ legacy flag ⇒ 跳 A;B 记录 CRC 复算通过 ⇒ 跳 B;否则留 BL 等 Ymodem。OTA 中途断电/中止 ⇒ 重启落 B 跑出厂固件,**设备不变砖**。
工程侧的适配点:
- `LD/gd32e23x_flash.ld`:FLASH `ORIGIN = 0x08002000, LENGTH = 36K`;
- `Src/system_gd32e23x.c`:`VECT_TAB_OFFSET = 0x2000`——Bootloader 不写 VTOR,APP 必须自己把向量表指到 `0x08002000`,否则中断会落回 Bootloader 向量表(现象:收到第一个 RS485 字节即死机);
- 出厂保底固件在 `release/golden` 分支构建(`ORIGIN=0x0800B000 / LENGTH=0x4BF8`、`VECT_TAB_OFFSET=0xB000`,版本冻结 V1.0.3 = **生产实装版原样复制**——命令集 M1~M4 + M999/M9999、LDC1612 驱动电流 `GEN(8)`、旧 8 位寄存器地址 i2c 驱动;判定值 `v26.1.0.3`);
- 打包(`_UPDATE/_FULL/_FACTORY` + MD5)用 merge tool / `hulk-mcu-firmware` skill,profile `CeramixNano_EDDY_Dual_FW`;产物命名 `CeramixNano-EDDY_*`(板卡码 26)。
⚠️ 与旧版 54K 单槽布局不兼容:需整片烧录一次(FACTORY/FULL 镜像)。RS485 协议、命令集(M1-M6/M999/M9999)与回包格式无任何变化。方案完全体文档见 MB 仓库 `doc/双固件方案_完全体说明.md`;开发约定与实测记录见本项目 `AGENTS.md`。
---
## 适用范围
- 适用于兆易创新 GD32E23x 系列 Cortex-M23 内核单片机
@@ -34,37 +83,49 @@
### 1. xPack GNU Arm Embedded GCC Toolchain
- **版本**:xpack-arm-none-eabi-gcc-11.3.1-1.1
- **建议解压路径**:Tools/xpack-arm-none-eabi-gcc-11.3.1-1.1
- **原模板版本**:xpack-arm-none-eabi-gcc-11.3.1-1.1;本机编译验证使用 15.2.1-1.1。
- **安装位置**:由本机统一管理,不提交到仓库。
- **官方下载地址**:https://github.com/xpack-dev-tools/arm-none-eabi-gcc-xpack/releases
- **路径自定义说明**:
如需自定义工具链路径,请同步修改以下文件:
- `Projects/<BoardName>/<ProjectName>/cmake/arm-none-eabi-gcc.cmake`(第2行)
- `Projects/<BoardName>/<ProjectName>/.vscode/launch.json`(第12行)
编译器与 GDB 均通过 `GD32_GCC_BIN` 环境变量定位(或配置时传 `-DTOOLCHAIN_DIRECTORY`),CMake 文件与 `.vscode` 均无需修改路径。
### 2. OpenOCD
### 2. OpenOCD(GD-Link 支持)
- **版本**:xpack-openocd-0.11.0-3
- **建议解压路径**:Tools/xpack-openocd-0.11.0-3
- **获取地址**:https://github.com/burakenez/gd32-tools-xpack-openocd/tree/v0.11.0-3
- **说明**:
- 本版本提取自 Embedded Builder V1.4.1.23782。
- ⚠️ 请勿随意更换版本,因 GD32 MCU 支持有限,推荐严格使用此版本。
- **路径自定义说明**:
如需自定义 OpenOCD 路径,请同步修改以下文件:
- `Projects/<BoardName>/<ProjectName>/.vscode/launch.json`(第14、17行)
- `Projects/<BoardName>/<ProjectName>/.vscode/task.json` 中所有相关路径
通过两个环境变量定位,安装位置任意:
- `GD32_OPENOCD_BIN`:`openocd.exe` 所在 `bin` 目录;
- `GD32_OPENOCD_SCRIPTS`:OpenOCD `scripts` 目录。
`.vscode` 的调试配置与烧录任务全部读取这两个变量,无需修改任何文件。
---
## 使用说明
1. **准备工具链**
- 按上述说明下载并解压 ARM GCC 和 OpenOCD 到 Tools 目录。
- Toolchain 目录内容不会被 git 跟踪,需自行维护。
1. **配置环境变量**(用户级,按本机安装位置设置一次即可)
2. **烧录固件**
- 可直接使用 VSCode 任务栏的 Flash MCU 任务,或命令行运行 OpenOCD。
| 环境变量 | 指向 | 用途 |
|---|---|---|
| `GD32_GCC_BIN` | ARM GCC 的 `bin` 目录 | 编译、GDB 调试 |
| `GD32_OPENOCD_BIN` | OpenOCD 的 `bin` 目录 | 烧录、调试 |
| `GD32_OPENOCD_SCRIPTS` | OpenOCD 的 `scripts` 目录 | 烧录、调试 |
设置后重开终端 / VSCode 生效。`cmd` 示例:`setx GD32_GCC_BIN "D:\toolchain\xpack-arm-none-eabi-gcc-15.2.1-1.1\bin"`。
2. **编译**
命令行见上文[本地编译](#本地编译),或直接用 VSCode 的 CMake Tools 选择 Debug / Release preset 构建。
3. **烧录固件**
- **OpenOCD(GD-Link)**:VSCode 任务 `Flash MCU`(连带编译用 `Build and Flash`);另有 `Reset MCU`、`Mass Erase MCU`、`OpenOCD Server` 任务。
- **J-Link**:任务 `Flash MCU (Jlink)` 等,依赖构建生成的 `Build/<preset>/Application/Application.hex`。
- 器件与接口在 `.vscode/settings.json` 的 `gd32.jlink.*` / `gd32.openocd.*` 中配置,当前为 GD32E230F8 / SWD。
4. **调试**
VSCode 调试配置有两个:`Debug with OpenOCD` 与 `Debug with J-Link`(均使用 cortex-debug,SVD 文件 `GD32E230.svd`,支持外设寄存器查看)。烧录调试器以 GD-Link 为例;J-Link 直接选用对应配置即可。
---
@@ -129,7 +190,6 @@
- **快速上手示例**:如 main.c 的最小点灯/串口输出代码片段。
- **常见问题与解答**:如构建失败、烧录失败的排查建议。
- **调试说明**:如何用 VSCode 调试、断点、查看寄存器等。
- **多板卡适配说明**:如有多种硬件,如何切换 BoardName。
- **贡献指南**:如何提交 PR、代码风格约定等。
- **License 说明**:开源协议和版权声明。
+10 -92
View File
@@ -74,15 +74,6 @@
#define RESP_TYPE_LEN_ERR 0xF4 /**< 长度错误 */
/** @} */
/* 温度补偿参数定义
* TEMP_COMP_REF_TEMP_X10000: 参考温度,单位 0.0001°C
* TEMP_COMP_COEFF_NUMERATOR / TEMP_COMP_COEFF_DENOMINATOR: 温漂系数,默认表示 counts/°C
* 补偿公式: compensated = raw - (temp - ref) * coeff
*/
#define TEMP_COMP_REF_TEMP_X10000 (250000L)
#define TEMP_COMP_COEFF_NUMERATOR (0L)
#define TEMP_COMP_COEFF_DENOMINATOR (10000L)
/* ============================================================================
* 模块内部变量
* ============================================================================ */
@@ -104,9 +95,6 @@ static const uint8_t s_report_status_ok[] = { 'o', 'k' }; /**< 成功响应
static const uint8_t s_report_status_err[] = { 'e','r','r' }; /**< 错误响应数据 */
/** @} */
static int32_t tmp112_get_temperature_x10000(void);
static int64_t calculate_temperature_compensation_offset(int32_t temperature_x10000);
/* ============================================================================
* 公共接口函数
* ============================================================================ */
@@ -344,14 +332,6 @@ void handle_command(const uint8_t *frame, uint8_t len) {
temperature_raw_value_report();
return;
case 5u:
eddy_current_compensated_report();
return;
case 6u:
calibration_data_report();
return;
// case 201u: // M201命令
// send_response(RESP_TYPE_OK, s_report_status_ok, sizeof(s_report_status_ok));
// return;
@@ -533,82 +513,20 @@ void eddy_current_report(void) {
send_response(RESP_TYPE_OK, sensor_data, sizeof(sensor_data));
}
static int32_t tmp112_get_temperature_x10000(void)
{
uint8_t value[2] = {0};
int16_t temp_raw;
tmp112a_get_raw_temperature_value(value);
temp_raw = (int16_t)(((uint16_t)value[0] << 8) | value[1]);
temp_raw >>= 4;
return (int32_t)temp_raw * 625;
}
static int64_t calculate_temperature_compensation_offset(int32_t temperature_x10000)
{
int32_t delta_temp_x10000 = temperature_x10000 - TEMP_COMP_REF_TEMP_X10000;
return ((int64_t)delta_temp_x10000 * TEMP_COMP_COEFF_NUMERATOR) /
TEMP_COMP_COEFF_DENOMINATOR;
}
void temperature_raw_value_report(void) {
// if (!g_temperature_sensor_report_enabled) return;
uint8_t raw_result[4];
int32_t raw_value = tmp112_get_temperature_x10000();
uint8_t value[2] = {0};
uint32_t raw_value = 0;
raw_result[0] = (uint8_t)((uint32_t)raw_value >> 24);
raw_result[1] = (uint8_t)((uint32_t)raw_value >> 16);
raw_result[2] = (uint8_t)((uint32_t)raw_value >> 8);
raw_result[3] = (uint8_t)((uint32_t)raw_value & 0xFF);
// i2c_read_16bits(TMP112A_ADDR, TMP112A_TEMP_REG, value);
tmp112a_get_raw_temperature_value(value);
raw_value = (uint32_t)((uint16_t) (value[0] << 4) | (value[1]>>4)) * 625;
raw_result[0] = (uint8_t)(raw_value >> 24);
raw_result[1] = (uint8_t)(raw_value >> 16);
raw_result[2] = (uint8_t)(raw_value >> 8);
raw_result[3] = (uint8_t)(raw_value & 0xFF);
send_response(RESP_TYPE_OK, raw_result, sizeof(raw_result));
}
void eddy_current_compensated_report(void)
{
uint8_t sensor_data[4];
uint32_t raw_result = ldc1612_get_raw_channel_result(CHANNEL_0);
if ((raw_result & 0xF0000000u) == 0u) {
int32_t temperature_x10000 = tmp112_get_temperature_x10000();
int64_t compensated_value = (int64_t)raw_result -
calculate_temperature_compensation_offset(temperature_x10000);
if (compensated_value < 0) {
raw_result = 0;
} else if (compensated_value > 0x0FFFFFFFLL) {
raw_result = 0x0FFFFFFFu;
} else {
raw_result = (uint32_t)compensated_value;
}
}
sensor_data[0] = (uint8_t)(raw_result >> 24);
sensor_data[1] = (uint8_t)(raw_result >> 16);
sensor_data[2] = (uint8_t)(raw_result >> 8);
sensor_data[3] = (uint8_t)(raw_result & 0xFF);
send_response(RESP_TYPE_OK, sensor_data, sizeof(sensor_data));
}
void calibration_data_report(void)
{
uint8_t payload[9];
uint32_t eddy_raw_value = ldc1612_get_raw_channel_result(CHANNEL_0);
int32_t temperature_raw_value = tmp112_get_temperature_x10000();
payload[0] = (uint8_t)(eddy_raw_value >> 24);
payload[1] = (uint8_t)(eddy_raw_value >> 16);
payload[2] = (uint8_t)(eddy_raw_value >> 8);
payload[3] = (uint8_t)(eddy_raw_value & 0xFF);
payload[4] = 0xFF;
payload[5] = (uint8_t)((uint32_t)temperature_raw_value >> 24);
payload[6] = (uint8_t)((uint32_t)temperature_raw_value >> 16);
payload[7] = (uint8_t)((uint32_t)temperature_raw_value >> 8);
payload[8] = (uint8_t)((uint32_t)temperature_raw_value & 0xFF);
send_response(RESP_TYPE_OK, payload, sizeof(payload));
}
+1 -1
View File
@@ -41,7 +41,7 @@
#define __HXTAL (HXTAL_VALUE) /* high speed crystal oscillator frequency */
#define __SYS_OSC_CLK (__IRC8M) /* main oscillator frequency */
#define VECT_TAB_OFFSET (uint32_t)0x00 /* vector table base offset */
#define VECT_TAB_OFFSET (uint32_t)0xB000 /* vector table base offset, FW_B slot 0x0800B000 */
/* select a system clock by uncommenting the following line */
//#define __SYSTEM_CLOCK_8M_HXTAL (__HXTAL)
+94 -15
View File
@@ -1,5 +1,61 @@
# You can change TOOLCHAIN_DIRECTORY if you want to use different toolchain.
set(TOOLCHAIN_DIRECTORY "${CMAKE_SOURCE_DIR}/Toolchain/xpack-arm-none-eabi-gcc-11.3.1-1.1/bin")
# The project never stores a compiler package. Each machine supplies a path.
# TOOLCHAIN_DIRECTORY (CMake cache) has priority over the environment variable.
# GD32_GCC_ENV_VAR lets a workstation use a different variable name if needed.
set(TOOLCHAIN_DIRECTORY "" CACHE PATH "Path to arm-none-eabi toolchain bin directory")
set(GD32_GCC_ENV_VAR "GD32_GCC_BIN" CACHE STRING "Environment variable containing the ARM GCC path")
set(CMAKE_TRY_COMPILE_PLATFORM_VARIABLES TOOLCHAIN_DIRECTORY GD32_GCC_ENV_VAR)
if(GD32_GCC_ENV_VAR AND NOT GD32_GCC_ENV_VAR MATCHES "^GD32_[A-Za-z0-9_]+$")
message(FATAL_ERROR "GD32_GCC_ENV_VAR must use the GD32_ prefix: ${GD32_GCC_ENV_VAR}")
endif()
if(NOT TOOLCHAIN_DIRECTORY AND GD32_GCC_ENV_VAR)
if(DEFINED ENV{${GD32_GCC_ENV_VAR}} AND NOT "$ENV{${GD32_GCC_ENV_VAR}}" STREQUAL "")
file(TO_CMAKE_PATH "$ENV{${GD32_GCC_ENV_VAR}}" TOOLCHAIN_DIRECTORY)
endif()
endif()
if(NOT TOOLCHAIN_DIRECTORY)
message(FATAL_ERROR
"Cannot find ARM GCC toolchain. Set ${GD32_GCC_ENV_VAR} in the machine environment "
"or pass -DTOOLCHAIN_DIRECTORY=<toolchain-bin>.")
endif()
file(TO_CMAKE_PATH "${TOOLCHAIN_DIRECTORY}" TOOLCHAIN_DIRECTORY)
get_filename_component(TOOLCHAIN_DIRECTORY "${TOOLCHAIN_DIRECTORY}" ABSOLUTE)
if(WIN32)
set(TOOLCHAIN_SUFFIX ".exe")
else()
set(TOOLCHAIN_SUFFIX "")
endif()
# Accept either the package root or its bin directory.
if(NOT EXISTS "${TOOLCHAIN_DIRECTORY}/arm-none-eabi-gcc${TOOLCHAIN_SUFFIX}" AND
EXISTS "${TOOLCHAIN_DIRECTORY}/bin/arm-none-eabi-gcc${TOOLCHAIN_SUFFIX}")
set(TOOLCHAIN_DIRECTORY "${TOOLCHAIN_DIRECTORY}/bin")
endif()
set(_ARM_GCC_EXECUTABLE "${TOOLCHAIN_DIRECTORY}/arm-none-eabi-gcc${TOOLCHAIN_SUFFIX}")
set(_TOOLCHAIN_BINARIES
arm-none-eabi-gcc
arm-none-eabi-g++
arm-none-eabi-gdb
arm-none-eabi-ar
arm-none-eabi-ranlib
arm-none-eabi-as
arm-none-eabi-ld
arm-none-eabi-objcopy
arm-none-eabi-objdump
arm-none-eabi-size
)
foreach(_binary IN LISTS _TOOLCHAIN_BINARIES)
if(NOT EXISTS "${TOOLCHAIN_DIRECTORY}/${_binary}${TOOLCHAIN_SUFFIX}")
message(FATAL_ERROR
"ARM GCC toolchain is incomplete; missing ${_binary}${TOOLCHAIN_SUFFIX} in ${TOOLCHAIN_DIRECTORY}")
endif()
endforeach()
set(CMAKE_C_FLAGS_DEBUG "")
set(CMAKE_CXX_FLAGS_DEBUG "")
@@ -12,10 +68,6 @@ set(CMAKE_COLOR_DIAGNOSTICS ON)
set(CMAKE_EXPORT_COMPILE_COMMANDS ON CACHE INTERNAL "")
if(WIN32)
set(TOOLCHAIN_SUFFIX ".exe")
endif()
set(CMAKE_SYSTEM_NAME Generic)
set(CMAKE_SYSTEM_PROCESSOR arm)
@@ -28,21 +80,48 @@ set(FLAGS "-mcpu=cortex-m23 -std=gnu11 -fstack-usage -
set(ASM_FLAGS "-x assembler-with-cpp")
set(CPP_FLAGS "-fno-rtti -fno-exceptions -fno-threadsafe-statics")
set(CMAKE_C_COMPILER ${TOOLCHAIN_PREFIX}gcc${TOOLCHAIN_SUFFIX})
set(CMAKE_CXX_COMPILER ${TOOLCHAIN_PREFIX}g++${TOOLCHAIN_SUFFIX})
set(CMAKE_ASM_COMPILER ${TOOLCHAIN_PREFIX}gcc${TOOLCHAIN_SUFFIX})
set(_REQUESTED_C_COMPILER "${TOOLCHAIN_PREFIX}gcc${TOOLCHAIN_SUFFIX}")
if(DEFINED CMAKE_C_COMPILER AND CMAKE_C_COMPILER AND
IS_ABSOLUTE "${CMAKE_C_COMPILER}" AND
NOT CMAKE_C_COMPILER STREQUAL "${_REQUESTED_C_COMPILER}")
message(FATAL_ERROR
"The build directory is already configured for a different ARM GCC compiler:\n"
" cached: ${CMAKE_C_COMPILER}\n"
" selected: ${_REQUESTED_C_COMPILER}\n"
"Delete the build directory or run CMake Tools 'Delete Cache and Reconfigure'.")
endif()
set(CMAKE_C_COMPILER "${_REQUESTED_C_COMPILER}")
set(CMAKE_CXX_COMPILER "${TOOLCHAIN_PREFIX}g++${TOOLCHAIN_SUFFIX}")
set(CMAKE_ASM_COMPILER "${TOOLCHAIN_PREFIX}gcc${TOOLCHAIN_SUFFIX}")
set(CMAKE_C_FLAGS "${CMAKE_C_FLAGS} ${FLAGS}")
set(CMAKE_CXX_FLAGS "${CMAKE_CXX_FLAGS} ${FLAGS} ${CPP_FLAGS}")
set(CMAKE_ASM_FLAGS "${CMAKE_ASM_FLAGS} ${FLAGS} ${ASM_FLAGS}")
set(CMAKE_OBJCOPY ${TOOLCHAIN_PREFIX}objcopy${TOOLCHAIN_SUFFIX})
set(CMAKE_SIZE ${TOOLCHAIN_PREFIX}size${TOOLCHAIN_SUFFIX})
set(CMAKE_OBJDUMP ${TOOLCHAIN_PREFIX}objdump${TOOLCHAIN_SUFFIX})
set(CMAKE_AS ${TOOLCHAIN_PREFIX}as${TOOLCHAIN_SUFFIX})
set(CMAKE_LD ${TOOLCHAIN_PREFIX}ld${TOOLCHAIN_SUFFIX})
set(CMAKE_AR "${TOOLCHAIN_PREFIX}ar${TOOLCHAIN_SUFFIX}")
set(CMAKE_RANLIB "${TOOLCHAIN_PREFIX}ranlib${TOOLCHAIN_SUFFIX}")
set(CMAKE_OBJCOPY "${TOOLCHAIN_PREFIX}objcopy${TOOLCHAIN_SUFFIX}")
set(CMAKE_SIZE "${TOOLCHAIN_PREFIX}size${TOOLCHAIN_SUFFIX}")
set(CMAKE_OBJDUMP "${TOOLCHAIN_PREFIX}objdump${TOOLCHAIN_SUFFIX}")
set(CMAKE_AS "${TOOLCHAIN_PREFIX}as${TOOLCHAIN_SUFFIX}")
set(CMAKE_LD "${TOOLCHAIN_PREFIX}ld${TOOLCHAIN_SUFFIX}")
set(CMAKE_LINKER "${TOOLCHAIN_PREFIX}ld${TOOLCHAIN_SUFFIX}")
execute_process(
COMMAND "${_ARM_GCC_EXECUTABLE}" --version
OUTPUT_VARIABLE _ARM_GCC_VERSION_OUTPUT
ERROR_VARIABLE _ARM_GCC_VERSION_ERROR
RESULT_VARIABLE _ARM_GCC_VERSION_RESULT
OUTPUT_STRIP_TRAILING_WHITESPACE
)
if(NOT _ARM_GCC_VERSION_RESULT EQUAL 0)
message(FATAL_ERROR "Unable to execute ${_ARM_GCC_EXECUTABLE}: ${_ARM_GCC_VERSION_ERROR}")
endif()
string(REGEX MATCH "[0-9]+\\.[0-9]+\\.[0-9]+" _ARM_GCC_VERSION "${_ARM_GCC_VERSION_OUTPUT}")
message(STATUS "Using ARM GCC ${_ARM_GCC_VERSION} from ${TOOLCHAIN_DIRECTORY}")
set(CMAKE_EXECUTABLE_SUFFIX_ASM ".elf")
set(CMAKE_EXECUTABLE_SUFFIX_C ".elf")
set(CMAKE_EXECUTABLE_SUFFIX_CXX ".elf")
set(CMAKE_TRY_COMPILE_TARGET_TYPE STATIC_LIBRARY)
set(CMAKE_TRY_COMPILE_TARGET_TYPE STATIC_LIBRARY)
+7 -4
View File
@@ -1,9 +1,12 @@
# Project basic info
set(PROJECT_NAME "LDC1612")
set(BOARD_TYPE_CODE 23)
# golden 出厂保底线:生产实装版原样复制(GitLab ceramixnano_eddy_cmake_vscode dev@151828f,v26.1.0.3,2026-10-25)
# 保底判定值 = M999 返回 v26.1.0.3 ⇔ 在跑 FW_B;v26.1.0.2(旧 golden)与 v26.1.0.3 均永不再用于 OTA 升级包版本
# 此分支改动不得合回 dev/main(链接基址 0x0800B000 为 B 槽专属)
set(PROJECT_NAME "CeramixNano-EDDY")
set(BOARD_TYPE_CODE 26)
set(VERSION_MAJOR 1)
set(VERSION_MINOR 0)
set(VERSION_PATCH 1)
set(VERSION_PATCH 3)
set(VERSION "V${VERSION_MAJOR}.${VERSION_MINOR}.${VERSION_PATCH}")
string(TIMESTAMP BUILD_DATE "%Y-%m-%d")
@@ -11,7 +14,7 @@ string(TIMESTAMP BUILD_DATE "%Y-%m-%d")
# Example: HW-IIC_APP / HW-IIC_Bootloader
# set(BUILD_VARIANT "AutoDetectDriveCurrent")
# set(BUILD_VARIANT "HW-IIC")
set(BUILD_VARIANT "APP")
set(BUILD_VARIANT "golden")
# 其它自定义宏
add_definitions(-DBUILD_VARIANT=${BUILD_VARIANT})